Front-End applications

Front-End IC Chip Manufacture and the underlying applications are an essential part of the semiconductor industry. Key applications include wet bench processes, chemical mechanical planarization (cmp), wafer handling & processing and vacuum processes under low and high temperature. Wet Bench processes enable precise patterning on nanoscale. CMP ensures a polished flat surface while wafer handling devices often requires good dimensional stability, wear resistance and high temperature resistance. These technologies collectively form the foundation for advanced semiconductor manufacturing.

Materials and solutions for Wet Bench & Cleanroom

Materials for High and Low temperature

Arrange technical advice

The performance and service life of plastics for use in the semiconductor industry are influenced by a variety of factors. These criteria need to be considered in order to make the right choice in materials. Examples:

Antistatic or conductive properties
Operating temperature
Contact with chemicals
Design requirements
Dimensions and tolerances
Flame retardancy

We are happy to advise you on the selection of suitable materials for your particular application. Just use our contact form at the bottom of the page.